DARPA eyes creation of next-generation semiconductor manufacturing hub

Published on November 28, 2023

 

The Defense Advanced Research Projects Agency (DARPA) plans to award a contract next summer for its Next-Generation Microelectronics Manufacturing program, aiming to establish a U.S. hub for advanced microelectronics manufacturing by 2029. Focused on 3D heterogeneously integrated microsystems (3DHI), the program aims to enhance the U.S. semiconductor industrial base by creating a domestic center for prototyping cutting-edge fabrication techniques. This technology, which disaggregates functions like memory and processing to improve performance, could transform the U.S. industrial base and is of global interest, particularly to major microelectronics producers like Taiwan. DARPA will select a team for the next phases of the program, with awards for each phase potentially totaling up to $420 million, addressing concerns about the over-reliance on foreign supply chains for critical microsystems.

Link to the full article: https://www.c4isrnet.com/battlefield-tech/2023/11/22/darpa-eyes-creation-of-next-generation-semiconductor-manufacturing-hub/

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