UT’s Texas Institute for Electronics Awarded $840M To Build a DOD Microelectronics Manufacturing Center, Advance U.S. Semiconductor Industry

Published on August 9, 2024

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Seeking to ensure America’s national security and global military leadership, the Defense Advanced Research Project Agency (DARPA) has selected the Texas Institute for Electronics (TIE) at The University of Texas at Austin to develop the next generation of high-performing semiconductor microsystems for the Department of Defense. Under the agreement, TIE will establish a national open-access R&D and prototyping fabrication facility that will enable DOD to create higher-performance, lower-power, lightweight and compact defence systems. Such technology could apply to radar, satellite imaging, unmanned aerial vehicles or other systems.

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